Patents

US 11739023 B2: Low dielectric glass composition, fibers, and article

Granted
2023-08-29
Filed
2020-02-17 application 16792658
Type
Utility · 19 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Glass compositions and glass fibers having low dielectric constants and low dissipation factors that may be suitable for use in electronic applications and articles are disclosed. The glass fibers and compositions of the present invention may include between 48.0 to 58.0 weight percent SiO2; between 15.0 and 26.0 weight percent B2O3; between 12.0 and 18.0 weight percent Al2O3; between greater than 0.25 and 3.0 weight percent P2O5; between greater than 0.25 and 7.00 weight percent CaO; 5.0 or less weight percent MgO; between greater than 0 and 1.5 weight percent SnO2; and 6.0 or less weight percent TiO2. Further, the glass composition has a glass viscosity of 1000 poise at a temperature greater than 1350 degrees Celsius and a liquidus temperature greater than 1000 degrees Celsius.

Source: PVGPATDIS, file of 2026-04-10 (ipg230829.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
AGY HOLDING CORPORATION 6 patentsUS company or organizationAiken, SCAGY HOLDING CORPORATION Federal lobbying client EXACT high confidence: identical full name and state
AGY HOLDING CORP. SEC filer FUZZY low confidence: same name (legal endings aside), one of each nationally
AGY HOLDING CORP. State business registration FUZZY medium confidence: same name (legal endings aside) and state
PVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Robert Lurie HausrathAiken, SC5PVGPATDIS, file of 2026-04-10
Anthony V. LongobardoJohnston, SC5PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
C03CChemical composition of glasses, glazes or vitreous enamels; surface treatment of glass; surface treatment of fibres or filaments made from glass, minerals or slags; joining glass to glass or other materialsC03C13/006PVGPATDIS, file of 2026-04-10
C03BManufacture, shaping, or supplementary processesC03B37/02PVGPATDIS, file of 2026-04-10
H05KPrinted circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical componentsH05K1/0306PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2020-09-23Security interest Security interest
Security interest
AGY HOLDING CORP. signed 2020-09-22WELLS FARGO BANK, NATIONAL ASSOCIATION SANTA MONICA, CA53851/816ECORSEXC, file of 2026-09-25
2020-09-21Security interest Security interest
Security interest
AGY HOLDING CORP. signed 2020-09-03TCW ASSET MANAGEMENT COMPANY LLC NEW YORK, NY53836/429PASDL, file of 2026-10-15
2020-02-17Assignment
Assignment of assignor's interest
HAUSRATH, ROBERT LURIE signed 2018-03-05
LONGOBARDO, ANTHONY VINCENT signed 2018-03-05
AGY HOLDING CORPORATION AIKEN, SC51833/216ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.