Patents
US 11732377 B2: Methods for fabricating and etching porous silicon carbide structures
- Granted
- 2023-08-22
- Filed
- 2021-09-20 application 17479567
- Type
- Utility · 19 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
The present disclosure relates to methods of fabricating a porous structure, such as a porous silicon carbide structure. The methods can include a step of providing a structure to be rendered porous, and a step of providing an etching solution. The methods can also include a step of electrochemically etching the structure to produce pores through at least a region of the structure, resulting in the formation of a porous structure. The morphology of the porous structure can be controlled by one or more parameters of the electrochemical etching process, such as the strength of the etching solution and/or the applied voltage.
Source: PVGPATDIS, file of 2026-04-10 (ipg230822.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Elwha LLC 1,209 patents | US company or organization | Bellevue, WA | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Rachel Cannara | Kirkland, WA | 10 | PVGPATDIS, file of 2026-04-10 | |
| Emma Rae Mullen | Seattle, WA | 5 | PVGPATDIS, file of 2026-04-10 | |
| Fred Sharifi | Kirkland, WA | 9 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| C25D | Processes for the electrolytic or electrophoretic production of coatings; electroforming; apparatus therefor | C25D11/32 | PVGPATDIS, file of 2026-04-10 |
| H01L | Semiconductor devices not covered by class h10 | H01L21/3063 | PVGPATDIS, file of 2026-04-10 |
| C25F | Processes for the electrolytic removal of materials from objects; apparatus therefor | C25F3/12 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2024-03-12 | Assignment Assignment of assignor's interest | THE INVENTION SCIENCE FUND II, LLC signed 2024-02-20 | CARILLON TECHNOLOGIES LLC ARLINGTON, VA | 66733/579 | ECORSEXC, file of 2026-09-25 |
| 2024-03-12 | Assignment Assignment of assignor's interest | ELWHA LLC signed 2024-02-20 | THE INVENTION SCIENCE FUND II, LLC BELLEVUE, WA | 66732/618 | ECORSEXC, file of 2026-09-25 |
| 2021-09-20 | Assignment Assignment of assignor's interest | MULLEN, EMMA RAE signed 2020-04-14 | ELWHA LLC BELLEVUE, WA | 57536/830 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.