Patents
US 11630007 B2: Graphene/polymer heterostructure-based flexible and biocompatible pressure/strain sensor
- Granted
- 2023-04-18
- Filed
- 2020-06-23 application 16909453
- Type
- Utility · 19 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
Pressure/strain piezoresistive are described that include a poled piezoelectric polymer such as PVDF or P(VDF-TrFE) and graphene. The poled piezoelectric polymer and the graphene are electronically coupled to form a heterojunction and provide an ultra-high sensitivity pressure/strain sensor. The sensors can be carried on a flexible supporting substrate such as PDMS or PET to exhibit high flexibility. The materials of formation can be biocompatible and the sensors can be wearable or implantable.
Source: PVGPATDIS, file of 2026-04-10 (ipg230418.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Clemson University 122 patents | US company or organization | Clemson, SC | Clemson University State business registration EXACT high confidence: identical full name and state Clemson University College or university EXACT high confidence: identical full name and state | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Soaram Kim | Clemson, SC | 1 | PVGPATDIS, file of 2026-04-10 | |
| Goutam Koley | Clemson, SC | 10 | PVGPATDIS, file of 2026-04-10 | |
| Yongchang Dong | Clemson, SC | 3 | PVGPATDIS, file of 2026-04-10 | |
| Apparao M. Rao | Clemson, SC | 6 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| G01L | Measuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure | G01L1/18 | PVGPATDIS, file of 2026-04-10 |
| H01C | Resistors | H01C1/14 | PVGPATDIS, file of 2026-04-10 |
| H10N | Electric solid-state devices not otherwise provided for | H10N30/30 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2021-04-06 | Assignment Assignment of assignor's interest | DONG, YONGCHANG signed 2019-06-28 KOLEY, GOUTAM signed 2019-06-28 RAO, APPARAO M. signed 2019-06-28 KIM, SOARAM signed 2019-07-02 | CLEMSON UNIVERSITY CLEMSON, SC | 55835/660 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.