Patents

US 11629274 B2: Adhesive sheet and transparent electrode comprising the same

Granted
2023-04-18
Filed
2019-11-22 application 16692087
Type
Utility · 12 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

The present invention relates to an adhesive sheet. As the adhesive sheet of one embodiment of the present invention retains the properties of conventional adhesive sheet, such as excellent adhesion and durability in high temperature and humidity environment, it can be utilized for manufacturing large-scale electrodes at low prices, and the electrodes manufactured above can be used for various applications such as solar cell, display, and touch panel.

Source: PVGPATDIS, file of 2026-04-10 (ipg230418.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
LMS Co., Ltd. 85 patentsForeign company or organizationPyeongtaek-si, KRPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Yongwon ChoiPyeongtaek-si, KR14PVGPATDIS, file of 2026-04-10
Hosung NaPyeongtaek-si, KR1PVGPATDIS, file of 2026-04-10
Minsoo LeePyeongtaek-si, KR108PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
C09JAdhesives; non-mechanical aspects of adhesive processes in general; adhesive processes not provided for elsewhere; use of materials as adhesivesC09J7/385PVGPATDIS, file of 2026-04-10
G06FElectric digital data processingG06F3/0446PVGPATDIS, file of 2026-04-10
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiationH10F77/215PVGPATDIS, file of 2026-04-10
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, formB32B7/025PVGPATDIS, file of 2026-04-10
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distributionY02E10/50PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2019-11-22Assignment
Assignment of assignor's interest
LEE, MINSOO signed 2019-10-31
NA, HOSUNG signed 2019-10-31
CHOI, YONGWON signed 2019-11-05
LMS CO., LTD. PYEONGTAEK-SI, GYEONGGI-DO51087/129ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.