Patents
US 11485833 B2: Thermoplastic toughened matrix resins containing nanoparticles
- Granted
- 2022-11-01
- Filed
- 2019-10-23 application 16660934
- Type
- Utility · 14 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
Pre-impregnated composite material (prepreg) that can be cured/molded to form aerospace composite parts. The prepreg includes carbon reinforcing fibers and an uncured resin matrix. The resin matrix includes an epoxy resin component, polyethersulfone as a toughening agent, a thermoplastic particle component, a nanoparticle component and a curing agent.
Source: PVGPATDIS, file of 2026-04-10 (ipg221101.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Hexcel Corporation 118 patents | US company or organization | Dublin, CA | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Yan Zhu | Fremont, CA | 27 | PVGPATDIS, file of 2026-04-10 | |
| Gordon Emmerson | Dublin, CA | 11 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| C08K | Use of inorganic or non-macromolecular organic substances as compounding ingredients | C08K3/013 | PVGPATDIS, file of 2026-04-10 |
| B64C | Aeroplanes; helicopters | B64C1/00 | PVGPATDIS, file of 2026-04-10 |
| C08J | Working-up; general processes of compounding; after-treatment not covered by subclasses c08b, c08c, c08f, c08g or c08h | C08J5/243 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2020-10-15 | Assignment Assignment of assignor's interest | ZHU, YAN signed 2020-01-20 EMMERSON, GORDON T. signed 2020-01-21 | HEXCEL CORPORATION DUBLIN, CA | 54069/251 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.