Patents

US 11471980 B2: Method and system for ultrafast laser-based material removal, figuring and polishing

Granted
2022-10-18
Filed
2020-08-21 application 16999891
Type
Utility · 19 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

The disclosure relates to methods and systems incorporating physical modeling to identify the ultrafast laser/material interaction mechanisms and the impact of laser parameters, to optimize implementation of ultrafast laser-based processing for a given material. The process determines a laser fluence near the ablation threshold for a given material and given pulse duration. The repetition rate, scanning speed and scanning strategy are subsequently optimized to minimize heat accumulation, having an operable line scan overlap between 50% to 85% for achieving smooth ultrafast-laser polishing, while maintaining an optic-quality surface.

Source: PVGPATDIS, file of 2026-04-10 (ipg221018.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Rochester Institute of Technology 110 patentsUS company or organizationRochester, NYRochester Institute of Technology College or university EXACT high confidence: identical full name and state
ROCHESTER INSTITUTE OF TECHNOLOGY Nonprofit EXACT high confidence: identical full name and state
PVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Jie QiaoRochester, NY7PVGPATDIS, file of 2026-04-10
Lauren Leigh TaylorMedford, NJ1PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
B23KSoldering or unsoldering; welding; cladding or plating by soldering or welding; cutting by applying heat locally, e.g. flame cutting; working by laser beamB23K26/40PVGPATDIS, file of 2026-04-10
A61BDiagnosis; surgery; identificationA61B2018/00577PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2020-08-26Assignment
Assignment of assignor's interest
QIAO, JIE signed 2019-08-15
TAYLOR, LAUREN L. signed 2019-08-15
ROCHESTER INSTITUTE OF TECHNOLOGY ROCHESTER, NY53601/441ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.