Patents

US 11458678 B2: Method for SLS of PEKK and articles manufactured from the same

Granted
2022-10-04
Filed
2020-11-20 application 16953551
Type
Utility · 20 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A process for layer-by-layer manufacturing a three-dimensional object from a powder and objects made from the same is described. The process includes the step of applying a layer of a powder on a bed of a laser sintering machine. The powder includes polyetherketoneketone. The process further includes the step of solidifying selected points of the applied layer of powder by irradiation using heat energy introduced by a laser having a power L and successively repeating the step of applying the powder and the step of solidifying the applied layer of powder until all cross sections of a three-dimensional object are solidified. L is between 1 W and 20 W. In some embodiments L is between 1 and 10 W. In some embodiments, the powder is recycled PEKK powder. In some embodiments, the powder includes carbon fiber.

Source: PVGPATDIS, file of 2026-04-10 (ipg221004.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Hexcel Corporation 118 patentsUS company or organizationStamford, CTPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Scott DeFeliceHolyoke, MA25PVGPATDIS, file of 2026-04-10
Anthony DeCarmineLebanon, CT26PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
B29CShaping or joining of plastics; shaping of material in a plastic state, not otherwise provided for; after-treatment of the shaped products, e.g. repairingB29C64/153PVGPATDIS, file of 2026-04-10
B29BPreparation or pretreatment of the material to be shaped; making granules or preforms; recovery of plastics or other constituents of waste material containing plasticsB29B9/16PVGPATDIS, file of 2026-04-10
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for ; moulds, ; reinforcements, fillers or preformed parts, e.g. insertsB29K2071/00PVGPATDIS, file of 2026-04-10
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sinteringB33Y10/00PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2021-03-29Assignment
Assignment of assignor's interest
DECARMINE, ANTHONY signed 2018-01-18
DEFELICE, SCOTT signed 2018-01-18
HEXCEL CORPORATION STAMFORD, CT55749/452ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.