Patents

US 11353659 B2: Photonic chip features for fiber attachment

Granted
2022-06-07
Filed
2020-03-30 application 16834179
Type
Utility · 17 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A photonic chip including a trench at the periphery of the photonic chip forming a recessed rim, wherein the recessed rim includes at least one geometric feature separating a plurality of waveguide locations, the at least one geometric feature suitable to prevent adhesive flow between the plurality of waveguide locations and method for preventing adhesive flow from interfering with bonding of optical fibers to the photonic chip is disclosed. A photonic chip including at least one optical fiber groove which includes an entrance portion and a non-entrance portion, wherein the entrance portion includes a flared opening having a greater clearance than the non-entrance portion and method for attaching an optical fiber to the photonic chip minimizing damage to at least one of the optical fiber and the photonic chip is disclosed.

Source: PVGPATDIS, file of 2026-04-10 (ipg220607.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Rochester Institute of Technology 110 patentsUS company or organizationRochester, NYRochester Institute of Technology College or university EXACT high confidence: identical full name and state
ROCHESTER INSTITUTE OF TECHNOLOGY Nonprofit EXACT high confidence: identical full name and state
PVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Mario J. CiminelliRochester, NY11PVGPATDIS, file of 2026-04-10
Stefan PreblePittsford, NY8PVGPATDIS, file of 2026-04-10
Jeffrey SteidleRichmond, NY5PVGPATDIS, file of 2026-04-10
Paul Roger ThomasPittsford, NY11PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
G02BOptical elements, systems or apparatusG02B6/26PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2020-03-31Assignment
Assignment of assignor's interest
THOMAS, PAUL signed 2019-04-11
CIMINELLI, MARIO J. signed 2019-04-12
PREBLE, STEFAN signed 2019-07-15
STEIDLE, JEFFREY signed 2019-07-29
ROCHESTER INSTITUTE OF TECHNOLOGY ROCHESTER, NY52275/119ECORSEXC, file of 2026-09-25
2020-03-31Assignment
Assignment of assignor's interest
THOMAS, PAUL signed 2019-04-11
CIMINELLI, MARIO J. signed 2019-04-12
PREBLE, STEFAN signed 2019-07-15
STEIDLE, JEFFREY signed 2019-07-29
ROCHESTER INSTITUTE OF TECHNOLOGY ROCHESTER, NY52275/27ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.