Patents
US 11346015 B2: Electrolytic copper foil having high-temperature dimensional stability and texture stability, and manufacturing method therefor
- Granted
- 2022-05-31
- Filed
- 2019-01-25 application 16959360
- Type
- Utility · 5 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
The present invention relates to: an electrolytic copper foil having high dimensional stability and texture stability in a high temperature environment of a process for manufacturing an Li secondary battery; and a manufacturing method therefor. The electrolytic copper foil of the present invention has a thermal expansion coefficient of 17.1-22 μm/(m·° C.) in a temperature region of 30-190° C., has a variation of full width at half maximum of the (220) plane of 0.81-1.19 according to heat treatment for 30 minutes at 190° C., and has a weight deviation of 5% or less in the transverse direction.
Source: PVGPATDIS, file of 2026-04-10 (ipg220531.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| KCF TECHNOLOGIES, INC. 36 patents | US company or organization | Anyang-si, KR | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Seung Min KIM | Anyang-si, KR | 39 | PVGPATDIS, file of 2026-04-10 | |
| Joong Kyu An | Anyang-si, KR | 1 | PVGPATDIS, file of 2026-04-10 | |
| Shan Jin | Anyang-si, KR | 22 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| C25D | Processes for the electrolytic or electrophoretic production of coatings; electroforming; apparatus therefor | C25D1/04 | PVGPATDIS, file of 2026-04-10 |
| H01M | Processes or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy | H01M4/661 | PVGPATDIS, file of 2026-04-10 |
| Y10T | Technical subjects covered by former us classification | Y10T428/12431 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2020-11-24 | Name change [revised] change of name and corporate address | KCF TECHNOLOGIES CO., LTD. signed 2020-04-24 | SK NEXILIS CO., LTD. JEONGEUP-SI, JEOLLABUK-DO | 55693/699 | PASDL, file of 2026-10-15 |
| 2020-08-25 | Assignment Assignment of assignor's interest | JIN, SHAN HUA signed 2020-06-24 AN, JOONG KYU signed 2020-06-28 KIM, SEUNG MIN signed 2020-06-30 | KCF TECHNOLOGIES CO., LTD. ANYANG-SI, GYEONGGI-DO | 53591/53 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.