Patents
US 11143466 B2: Heat transfer system and method incorporating tapered flow field
- Granted
- 2021-10-12
- Filed
- 2018-06-26 application 16018927
- Type
- Utility · 6 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A heat transfer system including a fluid inlet; a fluid outlet; and a substrate in fluid communication with the fluid inlet and fluid outlet, the substrate including a heat exchange region having a heat transfer surface and a flow field adjacent the heat transfer surface, the flow field including a fluid flow area including an open region at the inlet, a heat transfer region in thermal communication with the heat exchange region, and a taper of the flow field cross-sectional area in the flow direction, wherein the flow field heat transfer region includes a plurality of spaced apart open enhancement features from 1 micron to 3 mm in size, and method for enhancing the heat transfer performance of an apparatus is disclosed.
Source: PVGPATDIS, file of 2026-04-10 (ipg211012.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Rochester Institute of Technology 110 patents | US company or organization | Rochester, NY | Rochester Institute of Technology College or university EXACT high confidence: identical full name and state ROCHESTER INSTITUTE OF TECHNOLOGY Nonprofit EXACT high confidence: identical full name and state | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Satish G. Kandlikar | Rochester, NY | 17 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| F28F | Details of heat-exchange and heat-transfer apparatus, of general application | F28F13/08 | PVGPATDIS, file of 2026-04-10 |
| H01L | Semiconductor devices not covered by class h10 | H01L23/473 | PVGPATDIS, file of 2026-04-10 |
| H10W | Generic packages, interconnections, connectors or other constructional details of devices covered by class h10 | H10W40/47 | PVGPATDIS, file of 2026-04-10 |
| F28D | Heat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact | F28D2021/0028 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2018-06-26 | Assignment Assignment of assignor's interest | KANDLIKAR, SATISH G. signed 2017-04-28 | ROCHESTER INSTITUTE OF TECHNOLOGY ROCHESTER, NY | 46205/803 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.