Patents
US 11090913 B2: Microwaved multi-ply structures, microwaved packages, and methods of sterilization
- Granted
- 2021-08-17
- Filed
- 2017-06-30 application 16337256
- Type
- Utility · 14 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
Multi-ply structures are provided that include a barrier film, which has a first polyester layer and a silicon oxide layer, a first adhesive layer, and a sealant film, where the first adhesive layer is located between the barrier film and the sealant film, and where the multi-ply structure has been microwaved in a pressurized vessel. Packages that are formed from the multi-ply structures are also provided in which these packages are microwaved in a pressurized vessel. Methods for sterilization are also provided.
Source: PVGPATDIS, file of 2026-04-10 (ipg210817.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Printpack Illinois, Inc. 61 patents | US company or organization | Elgin, IL | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Justin Houck | Marietta, GA | 3 | PVGPATDIS, file of 2026-04-10 | |
| James Ray | Marietta, GA | 3 | PVGPATDIS, file of 2026-04-10 | |
| Nilesh R. Savargaonkar | Marietta, GA | 12 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| B32B | Layered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form | B32B27/18 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2022-08-12 | Security interest Security interest Security interest | PRINTPACK ILLINOIS, INC. signed 2022-07-29 | JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT CHICAGO, IL | 60795/529 | PASDL, file of 2026-10-15 |
| 2021-04-30 | Security interest Security interest Security interest | PRINTPACK ILLINOIS, INC. signed 2021-04-23 | TRUIST BANK, AS ADMINISTRATIVE AGENT FOR THE SECURED PARTIES ATLANTA, GA | 56106/366 | PASDL, file of 2026-10-15 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.