Patents

US 11090838 B2: Polymer powder and method of preparing the same

Granted
2021-08-17
Filed
2020-04-21 application 16854290
Type
Utility · 16 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A powder composition suitable for use in laser sintering for printing a three-dimensional object. The powder composition includes a polyaryletherketone (PAEK) powder having a plurality of particles. The plurality of particles having a mean diameter of D50. The composition includes a plurality of carbon fibers having a mean length L50. L50 is greater than D50. The particles are substantially non-spherical. A portion of the carbon fiber is embedded into the particle via high intensity mixing.

Source: PVGPATDIS, file of 2026-04-10 (ipg210817.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Hexcel Corporation 118 patentsUS company or organizationStamford, CTPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Scott DeFeliceHolyoke, MA25PVGPATDIS, file of 2026-04-10
Anthony DeCarmineLebanon, CT26PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
B29BPreparation or pretreatment of the material to be shaped; making granules or preforms; recovery of plastics or other constituents of waste material containing plasticsB29B9/16PVGPATDIS, file of 2026-04-10
B02CCrushing, pulverising, or disintegrating in general; milling grainB02C23/10PVGPATDIS, file of 2026-04-10
B29CShaping or joining of plastics; shaping of material in a plastic state, not otherwise provided for; after-treatment of the shaped products, e.g. repairingB29C64/153PVGPATDIS, file of 2026-04-10
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sinteringB33Y10/00PVGPATDIS, file of 2026-04-10
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bondsC08G65/4012PVGPATDIS, file of 2026-04-10
C08JWorking-up; general processes of compounding; after-treatment not covered by subclasses c08b, c08c, c08f, c08g or c08hC08J3/12PVGPATDIS, file of 2026-04-10
C08LCompositions of macromolecular compoundsC08L71/12PVGPATDIS, file of 2026-04-10
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for ; moulds, ; reinforcements, fillers or preformed parts, e.g. insertsB29K2071/00PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2021-04-25Assignment
Assignment of assignor's interest
DECARMINE, ANTHONY signed 2018-01-18
DEFELICE, SCOTT signed 2018-01-18
HEXCEL CORPORATION STAMFORD, CT56030/629ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.