Patents
US 11070747 B2: Segmented focal plane array architecture
- Granted
- 2021-07-20
- Filed
- 2018-03-12 application 15919116
- Type
- Utility · 18 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
Various techniques are provided for implementing a segmented focal plane array (FPA) of infrared sensors. In one example, a system includes a segmented FPA. The segmented FPA includes a top die having an array of infrared sensors (e.g., bolometers). The top die may also include a portion of a read-out integrated circuit (ROIC). The segmented FPA also includes a bottom die having at least a portion of the ROIC. The top and the bottom dies are electrically coupled via inter-die connections. Advantageously, the segmented FPA may be fabricated with a higher yield and a smaller footprint compared with conventional FPA architectures. Moreover, the segmented FPA may be fabricated using different semiconductor processes for each die.
Source: PVGPATDIS, file of 2026-04-10 (ipg210720.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| FLIR Systems, Inc. 370 patents | US company or organization | Wilsonville, OR | FLIR SYSTEMS INC Form D issuer EXACT high confidence: identical full name and state FLIR SYSTEMS INC SEC filer EXACT medium confidence: identical full name, one of each nationally | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Brian B. Simolon | Lompoc, CA | 22 | PVGPATDIS, file of 2026-04-10 | |
| Eric A. Kurth | Lompoc, CA | 59 | PVGPATDIS, file of 2026-04-10 | |
| Mark Nussmeier | Goleta, CA | 30 | PVGPATDIS, file of 2026-04-10 | |
| Nicholas Högasten | Lompoc, CA | 92 | PVGPATDIS, file of 2026-04-10 | |
| Theodore R. Hoelter | Goleta, CA | 74 | PVGPATDIS, file of 2026-04-10 | |
| Katrin Strandemar | Rimbo, SE | 77 | PVGPATDIS, file of 2026-04-10 | |
| Pierre Boulanger | Goleta, CA | 60 | PVGPATDIS, file of 2026-04-10 | |
| Barbara Sharp | Lompoc, CA | 45 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H04N | Pictorial communication, e.g. television | H04N23/23 | PVGPATDIS, file of 2026-04-10 |
| H10F | Inorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation | H10F39/018 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2021-11-24 | Merger Merger and change of name | FLIR SYSTEMS, INC. signed 2021-05-14 FIREWORK MERGER SUB II, LLC signed 2021-05-14 | TELEDYNE FLIR, LLC THOUSAND OAKS, CA | 58250/300 | PASDL, file of 2026-10-15 |
| 2018-03-13 | Assignment Assignment of assignor's interest | KURTH, ERIC A. signed 2013-12-20 STRANDEMAR, KATRIN signed 2014-01-08 HÖGASTEN, NICHOLAS signed 2014-01-09 SIMOLON, BRIAN signed 2014-01-10 HOELTER, THEODORE R. signed 2014-01-13 SHARP, BARBARA signed 2014-01-15 BOULANGER, PIERRE signed 2014-01-16 NUSSMEIER, MARK signed 2014-01-24 | FLIR SYSTEMS, INC. WILSONVILLE, OR | 45194/731 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.