Patents
US 11069737 B2: Shallow trench textured regions and associated methods
- Granted
- 2021-07-20
- Filed
- 2019-07-08 application 16505283
- Type
- Utility · 55 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
Photosensitive devices and associated methods are provided. In one aspect, for example, a photosensitive imager device can include a semiconductor layer having multiple doped regions forming a least one junction, a textured region coupled to the semiconductor layer and positioned to interact with electromagnetic radiation. The textured region can be formed from a series of shallow trench isolation features.
Source: PVGPATDIS, file of 2026-04-10 (ipg210720.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| SiOnyx, LLC 58 patents | US company or organization | Beverly, MA | SIONYX Federal lobbying client FUZZY medium confidence: same name (legal endings aside) and state | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Homayoon Haddad | Beaverton, OR | 27 | PVGPATDIS, file of 2026-04-10 | |
| Jutao Jiang | Tigard, OR | 29 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H10F | Inorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation | H10F39/18 | PVGPATDIS, file of 2026-04-10 |
| B23K | Soldering or unsoldering; welding; cladding or plating by soldering or welding; cutting by applying heat locally, e.g. flame cutting; working by laser beam | B23K26/355 | PVGPATDIS, file of 2026-04-10 |
| B82Y | Specific uses or applications of nanostructures; measurement or analysis of nanostructures; manufacture or treatment of nanostructures | B82Y40/00 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2020-08-18 | Correction Conversion | SIONYX, INC. signed 2015-08-02 | SIONYX, LLC BEVERLY, MA | 53526/1 | ECORSEXC, file of 2026-09-25 |
| 2020-08-18 | Assignment Assignment of assignor's interest | HADDAD, HOMAYOON signed 2014-03-05 JIANG, JUTAO signed 2014-03-05 | SIONYX, INC. BEVERLY, MA | 53523/520 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.