Patents
US 11063159 B2: Methods for routing electrical interconnections and resultant structures
- Granted
- 2021-07-13
- Filed
- 2019-03-21 application 16360152
- Type
- Utility · 20 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
An optoelectronic device package includes an optoelectronic device having an active region on a first surface of a substrate, a bond pad area on the first surface that includes at least one contact pad electrically connected to the active region, and a cap having a first cap surface and a second cap surface, the first cap surface being secured to the first surface of the substrate, the cap covering the optoelectronic device. At least one of the cap and the substrate has an angled sidewall extending at an angle relative to an axis parallel to an optical path. The at least one contact pad is exposed by and adjacent to the angled sidewall. An electrical line extends from each of the at least one contact pad along the angled sidewall and to the second cap surface that does not overlap the active region.
Source: PVGPATDIS, file of 2026-04-10 (ipg210713.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| FLIR Systems, Inc. 370 patents | US company or organization | Wilsonville, OR | FLIR SYSTEMS INC Form D issuer EXACT high confidence: identical full name and state FLIR SYSTEMS INC SEC filer EXACT medium confidence: identical full name, one of each nationally | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Hagit Gershtenman-Avsian | Huntersville, NC | 3 | PVGPATDIS, file of 2026-04-10 | |
| Andrey Grinman | Charlotte, NC | 11 | PVGPATDIS, file of 2026-04-10 | |
| Alexander Feldman | Los Altos, CA | 5 | PVGPATDIS, file of 2026-04-10 | |
| Alan D. Kathman | Charlotte, NC | 25 | PVGPATDIS, file of 2026-04-10 | |
| David Ovrutsky | Charlotte, NC | 36 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H10F | Inorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation | H10F77/50 | PVGPATDIS, file of 2026-04-10 |
| H10W | Generic packages, interconnections, connectors or other constructional details of devices covered by class h10 | H10W74/00 | PVGPATDIS, file of 2026-04-10 |
| Y02E | Reduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution | Y02E10/50 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2021-11-24 | Merger Merger and change of name | FLIR SYSTEMS, INC. signed 2021-05-14 FIREWORK MERGER SUB II, LLC signed 2021-05-14 | TELEDYNE FLIR, LLC THOUSAND OAKS, CA | 58250/300 | PASDL, file of 2026-10-15 |
| 2019-03-22 | Assignment Assignment of assignor's interest | FELDMAN, ALEXANDER signed 2019-03-14 GERSHTENMAN-AVSIAN, HAGIT signed 2019-03-14 GRINMAN, ANDREY signed 2019-03-14 OVRUTSKY, DAVID signed 2019-03-14 KATHMAN, ALAN D. signed 2019-03-20 | FLIR SYSTEMS, INC. WILSONVILLE, OR | 48675/318 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.