Patents
US 10998124 B2: Nested flat wound coils forming windings for transformers and inductors
- Granted
- 2021-05-04
- Filed
- 2016-05-06 application 15148736
- Type
- Utility · 20 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
An electro-magnetic device is provided, including a first winding set of nested windings, and a second winding set of nested windings positioned adjacent to the first winding set. A method of making an electro-magnetic device including a first winding set of nested windings, and a second winding set of nested windings positioned adjacent to the first winding set is also provided.
Source: PVGPATDIS, file of 2026-04-10 (ipg210504.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Vishay Dale Electronics, LLC 74 patents | US company or organization | Columbus, NE | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Matthew Foley | Berwick, ME | 8 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H01F | Magnets; inductances; transformers; selection of materials for their magnetic properties | H01F27/2828 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2019-06-12 | Security interest Security interest Security interest | VISHAY DALE ELECTRONICS, INC. signed 2019-06-05 DALE ELECTRONICS, INC. signed 2019-06-05 VISHAY DALE ELECTRONICS, LLC signed 2019-06-05 VISHAY-DALE, INC. signed 2019-06-05 VISHAY INTERTECHNOLOGY, INC. signed 2019-06-05 SILICONIX INCORPORATED signed 2019-06-05 VISHAY-SILICONIX, INC. signed 2019-06-05 VISHAY-SILICONIX signed 2019-06-05 VISHAY SPRAGUE, INC. signed 2019-06-05 VISHAY EFI, INC. signed 2019-06-05 SPRAGUE ELECTRIC COMPANY signed 2019-06-05 VISHAY GENERAL SEMICONDUCTOR, INC. signed 2019-06-05 | JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT CHICAGO, IL | 49440/876 | PASDL, file of 2026-10-15 |
| 2017-02-21 | Assignment Assignment of assignor's interest | FOLEY, MATTHEW J. signed 2017-02-21 | VISHAY DALE ELECTRONICS, LLC COLUMBUS, NE | 41314/266 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.