Patents

US 10947354 B2: High temperature composite honeycomb

Granted
2021-03-16
Filed
2019-07-22 application 16518528
Type
Utility · 20 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Composite honeycomb that may be contoured to form composite honeycomb structures, which have tight radii of curvatures and/or compound curvatures, and which are suitable for use in high temperature environments. The method for making the composite honeycomb involves using high temperature prepreg to make a flexible composite honeycomb that is formed into a composite honeycomb precursor. A high temperature coating resin is applied to the composite honeycomb precursor to form the high temperature composite honeycomb.

Source: PVGPATDIS, file of 2026-04-10 (ipg210316.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Hexcel Corporation 118 patentsUS company or organizationDublin, CAPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Robert LoeschMesa, AZ2PVGPATDIS, file of 2026-04-10
Merid HaileCasa Grande, AZ7PVGPATDIS, file of 2026-04-10
Earl AyleChandler, AZ14PVGPATDIS, file of 2026-04-10
Clark SmithPhoenix, AZ3PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, formB32B3/12PVGPATDIS, file of 2026-04-10
B29CShaping or joining of plastics; shaping of material in a plastic state, not otherwise provided for; after-treatment of the shaped products, e.g. repairingB29C70/222PVGPATDIS, file of 2026-04-10
B29DProducing particular articles from plastics or from substances in a plastic stateB29D99/0089PVGPATDIS, file of 2026-04-10
C08JWorking-up; general processes of compounding; after-treatment not covered by subclasses c08b, c08c, c08f, c08g or c08hC08J5/042PVGPATDIS, file of 2026-04-10
E04CStructural elements; building materialsE04C2/365PVGPATDIS, file of 2026-04-10
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for ; moulds, ; reinforcements, fillers or preformed parts, e.g. insertsB29K2995/0001PVGPATDIS, file of 2026-04-10
B29LIndexing scheme associated with subclass b29c, relating to particular articlesB29L2031/7504PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2019-07-23Assignment
Assignment of assignor's interest
HAILE, MERID MINASSE signed 2019-07-18
LOESCH, ROBERT CHARLES signed 2019-07-18
SMITH, CLARK RUSSELL signed 2019-07-18
AYLE, EARL FREDERICK signed 2019-07-22
HEXCEL CORPORATION DUBLIN, CA49828/690ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.