Patents

US 10941259 B2: Thermoplastic/thermoset grafted composites

Granted
2021-03-09
Filed
2019-02-11 application 16272308
Type
Utility · 12 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Disclosed are thermoset/thermoplastic composites that include a thermoset component directly or indirectly bonded to a thermoplastic component via a crosslinked binding layer between the two. The crosslinked binding layer is bonded to the thermoplastic component via epoxy linkages and is either directly or indirectly bonded to the thermoset component via epoxy linkages. The composite can be a laminate and can provide a route for addition of a thermoplastic implant to a thermoset structure.

Source: PVGPATDIS, file of 2026-04-10 (ipg210309.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
University of South Carolina 570 patentsUS company or organizationColumbia, SCUNIVERSITY OF SOUTH CAROLINA Federal lobbying client EXACT high confidence: identical full name and statePVGPATDIS, file of 2026-04-10
Clemson University 122 patentsUS company or organizationClemson, SCClemson University State business registration EXACT high confidence: identical full name and state
Clemson University College or university EXACT high confidence: identical full name and state
PVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Michael van ToorenColumbia, SC33PVGPATDIS, file of 2026-04-10
Igor LuzinovSeneca, SC23PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
C08JWorking-up; general processes of compounding; after-treatment not covered by subclasses c08b, c08c, c08f, c08g or c08hC08J5/128PVGPATDIS, file of 2026-04-10
B29CShaping or joining of plastics; shaping of material in a plastic state, not otherwise provided for; after-treatment of the shaped products, e.g. repairingB29C37/0078PVGPATDIS, file of 2026-04-10
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, formB32B37/1207PVGPATDIS, file of 2026-04-10
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for ; moulds, ; reinforcements, fillers or preformed parts, e.g. insertsB29K2063/00PVGPATDIS, file of 2026-04-10
B29LIndexing scheme associated with subclass b29c, relating to particular articlesB29L2009/00PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2019-02-11Assignment
Assignment of assignor's interest
LUZINOV, IGOR signed 2015-09-11CLEMSON UNIVERSITY CLEMSON, SC48295/237ECORSEXC, file of 2026-09-25
2019-02-11Assignment
Assignment of assignor's interest
VAN TOOREN, MICHAEL signed 2015-09-11UNIVERSITY OF SOUTH CAROLINA COLUMBIA, SC48295/181ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.