Patents
US 10875286 B2: Multilayer shrink film with scission layer
- Granted
- 2020-12-29
- Filed
- 2016-03-31 application 15086190
- Type
- Utility · 12 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
Various embodiments of multilayer polymer films and multilayer structures with enhanced tear strength are provided. Also disclosed are processes and systems for producing the disclosed multilayer polymer films. The disclosed films comprise a first polymer that may be cross-linkable upon exposure to radiation, and a second polymer that is cleaved or broken when exposed to irradiation. Layers comprising the first polymer are referred to as bulk layers, and layers comprising the second polymer are referred to as scission layers. Scission layers are positioned between bulk layers. The bulk and scission layers may comprise one or more sublayers.
Source: PVGPATDIS, file of 2026-04-10 (ipg201229.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Clysar LLC 1 patents | US company or organization | De Witt, IA | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Guangda Shi | De Witt, IA | 5 | PVGPATDIS, file of 2026-04-10 | |
| Kurt Bormann | De Witt, IA | 4 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| B32B | Layered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form | B32B37/144 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2020-11-13 | Assignment Assignment of assignor's interest | SHI, GUANGDA signed 2020-10-30 BORMANN, KURT signed 2020-11-04 | CLYSAR LLC CLINTON, IA | 54367/38 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.