Patents
US 10787752 B2: Copper foil with minimized bagginess, wrinkle or tear, electrode including the same, secondary battery including the same and method for manufacturing the same
- Granted
- 2020-09-29
- Filed
- 2018-09-10 application 16126470
- Type
- Utility · 13 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
Disclosed is a copper foil including a copper layer and having a tensile strength of 29 to 65 kgf/mm2, a mean width of roughness profile elements (Rsm) of 18 to 148 μm and a texture coefficient bias [TCB(220)] of 0.52 or less.
Source: PVGPATDIS, file of 2026-04-10 (ipg200929.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| KCF TECHNOLOGIES, INC. 36 patents | US company or organization | Anyang-si, KR | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Seung Min KIM | Anyang-si, KR | 39 | PVGPATDIS, file of 2026-04-10 | |
| Jeong-gil Lee | Anyang-si, KR | 14 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| C25D | Processes for the electrolytic or electrophoretic production of coatings; electroforming; apparatus therefor | C25D3/38 | PVGPATDIS, file of 2026-04-10 |
| H05K | Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components | H05K1/0393 | PVGPATDIS, file of 2026-04-10 |
| Y02E | Reduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution | Y02E60/10 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2020-11-24 | Name change [revised] change of name and corporate address | KCF TECHNOLOGIES CO., LTD. signed 2020-04-24 | SK NEXILIS CO., LTD. JEONGEUP-SI, JEOLLABUK-DO | 55693/699 | PASDL, file of 2026-10-15 |
| 2019-04-16 | Assignment Assignment of assignor's interest | KIM, SEUNG MIN signed 2019-04-12 LEE, JEONG GIL signed 2019-04-12 | KCF TECHNOLOGIES CO., LTD. ANYANG-SI, GYEONGGI-DO | 48893/23 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.