Patents
US 10766197 B2: Apparatus and method for selective laser sintering an object with a void
- Granted
- 2020-09-08
- Filed
- 2017-03-27 application 15470328
- Type
- Utility · 18 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A method of producing an object from a polymer powder using a laser sintering system, whereby the laser sintering system introduces heat energy to solidify select points of a layer of polymer powder according to build data of the object and adjusts the heat energy according to solidification of select points of other layers.
Source: PVGPATDIS, file of 2026-04-10 (ipg200908.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Hexcel Corporation 118 patents | US company or organization | Stamford, CT | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Scott DeFelice | Holyoke, MA | 25 | PVGPATDIS, file of 2026-04-10 | |
| Anthony DeCarmine | Lebanon, CT | 26 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| B29C | Shaping or joining of plastics; shaping of material in a plastic state, not otherwise provided for; after-treatment of the shaped products, e.g. repairing | B29C64/393 | PVGPATDIS, file of 2026-04-10 |
| B33Y | Additive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering | B33Y10/00 | PVGPATDIS, file of 2026-04-10 |
| B29K | Indexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for ; moulds, ; reinforcements, fillers or preformed parts, e.g. inserts | B29K2071/00 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2026-03-13 | Security interest Security interest Security interest | OXFORD PERFORMANCE MATERIALS, INC. signed 2026-03-13 | KENSTON CAPITAL EMERGING TECHNOLOGY FUND I LP BOSTON, MA | 74077/347 | PASDL, file of 2026-10-08 |
| 2018-01-17 | Assignment Assignment of assignor's interest | OXFORD PERFORMANCE MATERIALS, INC. signed 2018-01-09 | HEXCEL CORPORATION STAMFORD, CT | 44640/722 | PASDL, file of 2026-10-15 |
| 2017-03-28 | Assignment Assignment of assignor's interest | DECARMINE, ANTHONY signed 2017-03-24 DEFELICE, SCOTT signed 2017-03-24 | OXFORD PERFORMANCE MATERIALS, INC. SOUTH WINDSOR, CT | 41758/882 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.