Patents
US 10741848 B2: Copper foil having improved adhesive force, electrode including the same, secondary battery including the same, and method of manufacturing the same
- Granted
- 2020-08-11
- Filed
- 2018-03-07 application 15914568
- Type
- Utility · 10 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
Provided is a copper foil. The copper foil includes a copper layer and a protective layer disposed on the copper layer, wherein a surface of the protective layer has a maximum height roughness (Rmax) of 0.6 μm to 3.5 μm, a peak density (PD) of 5 to 110, and an oxygen atomic amount of 22 at % (atomic %) to 67 at %.
Source: PVGPATDIS, file of 2026-04-10 (ipg200811.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| KCF TECHNOLOGIES, INC. 36 patents | US company or organization | Anyang-si, KR | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Seung Min KIM | Anyang-si, KR | 39 | PVGPATDIS, file of 2026-04-10 | |
| Shan Jin | Anyang-si, KR | 22 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H01M | Processes or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy | H01M4/667 | PVGPATDIS, file of 2026-04-10 |
| C23C | Coating metallic material; coating material with metallic material; surface treatment of metallic material by diffusion into the surface, by chemical conversion or substitution; coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general | C23C22/37 | PVGPATDIS, file of 2026-04-10 |
| C25D | Processes for the electrolytic or electrophoretic production of coatings; electroforming; apparatus therefor | C25D1/04 | PVGPATDIS, file of 2026-04-10 |
| Y02E | Reduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution | Y02E60/10 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2020-11-24 | Name change [revised] change of name and corporate address | KCF TECHNOLOGIES CO., LTD. signed 2020-04-24 | SK NEXILIS CO., LTD. JEONGEUP-SI, JEOLLABUK-DO | 55693/699 | PASDL, file of 2026-10-15 |
| 2018-07-23 | Assignment Assignment of assignor's interest | LS MTRON LTD. signed 2018-07-19 | KCF TECHNOLOGIES CO., LTD. ANYANG-SI, GYEONGGI-DO | 46424/303 | PASDL, file of 2026-10-15 |
| 2018-03-12 | Assignment Assignment of assignor's interest | JIN, SHAN HUA signed 2018-02-13 KIM, SEUNG MIN signed 2018-02-23 | LS MTRON LTD. ANYANG-SI, GYEONGGI-DO | 45177/464 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.