Patents
US 10669627 B2: Multi-layer deposition system and process
- Granted
- 2020-06-02
- Filed
- 2017-08-30 application 15691593
- Type
- Utility · 12 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A modular multilayer deposition system includes a plurality of modular deposition chambers, including at least one parylene deposition chamber and at least one ALD deposition chamber. The parylene deposition chamber is connected in series with the ALD deposition chamber. Substrates are automatically moved from within the parylene deposition chamber to within the ALD deposition chamber or from within the ALD deposition chamber to the parylene deposition chamber.
Source: PVGPATDIS, file of 2026-04-10 (ipg200602.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| HZO, Inc. 41 patents | US company or organization | Morrisville, NC | HZO, INC. Form D issuer EXACT high confidence: identical full name and state | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Yang Yun | Draper, UT | 9 | PVGPATDIS, file of 2026-04-10 | |
| Max Sorenson | Herriman, UT | 24 | PVGPATDIS, file of 2026-04-10 | |
| Chien-Lan Hsueh | Draper, UT | 19 | PVGPATDIS, file of 2026-04-10 | |
| Tining Su | Draper, UT | 6 | PVGPATDIS, file of 2026-04-10 | |
| Jim Dempster | Reno, NV | 1 | PVGPATDIS, file of 2026-04-10 | |
| Alex Anderson | Draper, UT | 3 | PVGPATDIS, file of 2026-04-10 | |
| Layton Baker | Draper, UT | 4 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| C23C | Coating metallic material; coating material with metallic material; surface treatment of metallic material by diffusion into the surface, by chemical conversion or substitution; coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general | C23C16/45525 | PVGPATDIS, file of 2026-04-10 |
| H01L | Semiconductor devices not covered by class h10 | H01L21/67161 | PVGPATDIS, file of 2026-04-10 |
| H10P | Generic processes or apparatus for the manufacture or treatment of devices covered by class h10 | H10P72/0452 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2023-06-05 | Security interest Security interest Security interest | HZO, INC. signed 2023-06-05 HZO HONG KONG LIMITED signed 2023-06-05 | CATHAY BANK EL MONTE, CA | 63861/25 | PASDL, file of 2026-10-05 |
| 2019-10-21 | Assignment Assignment of assignor's interest | DEMPSTER, JIM signed 2017-10-02 YUN, YANG signed 2017-10-03 ANDERSON, ALEX signed 2017-10-23 HSUEH, CHIEN-LAN signed 2017-11-01 SU, TINING signed 2017-12-17 SORENSEN, MAX signed 2017-12-21 | HZO, INC. DRAPER, UT | 50777/863 | ECORSEXC, file of 2026-09-25 |
| 2019-09-17 | Assignment Assignment of assignor's interest | BAKER, LAYTON signed 2019-08-19 | HZO, INC. DRAPER, UT | 50404/754 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.