Patents

US 10659873 B2: Spatial encoding directional microphone array

Granted
2020-05-19
Filed
2019-07-29 application 16524633
Type
Utility · 20 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

In one embodiment, an article of manufacture has microphones mounted at different locations on a non-spheroidal device body and a signal-processing system that processes the microphone signals to generate a B Format audio output having a zeroth-order beampattern signal and three first-order beampattern signals in three orthogonal directions. The signal-processing system generates at least one of the first-order beampattern signals based on effects of the device body on an incoming acoustic signal. The microphone signals used to generate each first-order beampattern signal have an inter-microphone effective distance that is less than a wavelength at a specified high-frequency value (e.g., <4 cm for 8 kHz). In preferred embodiments, the inter-microphone effective distance is less than one-half of that wavelength (e.g., <2 cm for 8 kHz). In addition, the inter-phase-center effective distances for the different first-order beampattern signals are also less than that wavelength, and preferably less than one-half of that wavelength.

Source: PVGPATDIS, file of 2026-04-10 (ipg200519.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
MH Acoustics, LLC 19 patentsUS company or organizationSummit, NJPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Gary W. ElkoSummit, NJ26PVGPATDIS, file of 2026-04-10
Tomas F. GaenslerHackettstown, NJ11PVGPATDIS, file of 2026-04-10
Jens M. MeyerSaint Albans, VT17PVGPATDIS, file of 2026-04-10
Eric John DiethornLong Valley, NJ20PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers; electric hearing aids; public address systemsH04R1/406PVGPATDIS, file of 2026-04-10
H04SStereophonic systemsH04S2400/15PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2019-07-31Assignment
Assignment of assignor's interest
DIETHORN, ERIC J. signed 2019-07-25
ELKO, GARY W. signed 2019-07-25
GAENSLER, TOMAS F. signed 2019-07-25
MEYER, JENS M. signed 2019-07-25
MH ACOUSTICS, LLC SUMMIT, NJ49915/682ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.