Patents
US 10553512 B2: Hybrid parylene-metal oxide layers for corrosion resistant coatings
- Granted
- 2020-02-04
- Filed
- 2016-11-09 application 15347646
- Type
- Utility · 20 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
Described herein is a composite coating on a substrate including a parylene layer deposited on a substrate surface of a substrate, a metal oxide layer covering the parylene layer, and a metal oxide, parylene hybrid layer formed between the metal oxide layer and the parylene layer.
Source: PVGPATDIS, file of 2026-04-10 (ipg200204.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| HZO, Inc. 41 patents | US company or organization | Morrisville, NC | HZO, INC. Form D issuer EXACT high confidence: identical full name and state | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Layton Baker | Draper, UT | 4 | PVGPATDIS, file of 2026-04-10 | |
| Sean Clancy | Draper, UT | 8 | PVGPATDIS, file of 2026-04-10 | |
| Chien-Lan Hsueh | Draper, UT | 19 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H01L | Semiconductor devices not covered by class h10 | H01L23/291 | PVGPATDIS, file of 2026-04-10 |
| H10W | Generic packages, interconnections, connectors or other constructional details of devices covered by class h10 | H10W74/43 | PVGPATDIS, file of 2026-04-10 |
| B05D | Processes for applying fluent materials to surfaces, in general | B05D1/60 | PVGPATDIS, file of 2026-04-10 |
| H05K | Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components | H05K3/284 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2023-06-05 | Security interest Security interest Security interest | HZO, INC. signed 2023-06-05 HZO HONG KONG LIMITED signed 2023-06-05 | CATHAY BANK EL MONTE, CA | 63861/25 | PASDL, file of 2026-10-05 |
| 2019-12-19 | Assignment Assignment of assignor's interest | CLANCY, SEAN signed 2018-01-22 HSUEH, CHIEN-LAN signed 2018-01-24 | HZO, INC. MORRISVILLE, NC | 51330/765 | ECORSEXC, file of 2026-09-25 |
| 2019-09-17 | Assignment Assignment of assignor's interest | BAKER, LAYTON signed 2019-08-19 | HZO, INC. DRAPER, UT | 50404/741 | ECORSEXC, file of 2026-09-25 |
| 2019-02-07 | Security interest Security interest Security interest | HZO, INC. signed 2019-02-04 | CATHAY BANK EL MONTE, CA | 48284/626 | ECORSEXC, file of 2026-09-25 |
| 2018-01-03 | Security interest Security interest Security interest | HZO, INC. signed 2017-12-27 | CATHAY BANK EL MONTE, CA | 44995/270 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.