Patents

US 10541529 B2: Methods, apparatuses and systems for sensing exposure of electronic devices to moisture

Granted
2020-01-21
Filed
2015-09-29 application 14868825
Type
Utility · 17 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Systems, devices and methods for sensing moisture within an electronic device are disclosed. A device may include a housing and a display defining and exterior of an electronic device and an interior of the electronic device. Further, the device may include an integrated circuit (IC) within the electronic device and comprising a control element. The device may also include a moisture sensor such as an inductive sensor, a capacitance sensor, or both. The moisture sensor, which may be part of the IC, together with the control element may sense moisture within the electronic device.

Source: PVGPATDIS, file of 2026-04-10 (ipg200121.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
HZO, Inc. 41 patentsUS company or organizationMorrisville, NCHZO, INC. Form D issuer EXACT high confidence: identical full name and statePVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Marcellus HarperKaysville, UT21PVGPATDIS, file of 2026-04-10
Jason MaynardSalt Lake City, UT15PVGPATDIS, file of 2026-04-10
Blake StevensMorristown, NJ22PVGPATDIS, file of 2026-04-10
Max SorensonHerriman, UT24PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
H02HEmergency protective circuit arrangementsH02H5/083PVGPATDIS, file of 2026-04-10
G01NInvestigating or analysing materials by determining their chemical or physical propertiesG01N27/02PVGPATDIS, file of 2026-04-10
G01RMeasuring electric variables; measuring magnetic variablesG01R27/2605PVGPATDIS, file of 2026-04-10
G06FElectric digital data processingG06F1/1656PVGPATDIS, file of 2026-04-10
H05BElectric heating; electric light sources not otherwise provided for; circuit arrangements for electric light sources, in generalH05B1/02PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2023-06-05Security interest Security interest
Security interest
HZO, INC. signed 2023-06-05
HZO HONG KONG LIMITED signed 2023-06-05
CATHAY BANK EL MONTE, CA63861/25PASDL, file of 2026-10-05
2019-02-07Security interest Security interest
Security interest
HZO, INC. signed 2019-02-04CATHAY BANK EL MONTE, CA48284/626ECORSEXC, file of 2026-09-25
2018-01-22Assignment
Assignment of assignor's interest
MAYNARD, JASON signed 2014-09-25
HARPER, MARCELLUS signed 2014-09-27
SORENSON, MAX signed 2015-07-15
STEVENS, BLAKE signed 2015-07-15
HZO, INC. DRAPER, UT44687/743ECORSEXC, file of 2026-09-25
2018-01-03Security interest Security interest
Security interest
HZO, INC. signed 2017-12-27CATHAY BANK EL MONTE, CA44995/270ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.