Patents

US 10484855 B2: Process module for increasing the response of backside illuminated photosensitive imagers and associated methods

Granted
2019-11-19
Filed
2019-04-23 application 16391540
Type
Utility · 16 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Backside illuminated photosensitive devices and associated methods are provided. In one aspect, for example, a backside-illuminated photosensitive imager device can include a semiconductor substrate having multiple doped regions forming a least one junction, a textured region coupled to the semiconductor substrate and positioned to interact with electromagnetic radiation where the textured region includes surface features sized and positioned to facilitate tuning to a preselected wavelength of light, and a dielectric region positioned between the textured region and the at least one junction. The dielectric region is positioned to isolate the at least one junction from the textured region, and the semiconductor substrate and the textured region are positioned such that incoming electromagnetic radiation passes through the semiconductor substrate before contacting the textured region. Additionally, the device includes an electrical transfer element coupled to the semiconductor substrate to transfer an electrical signal from the at least one junction.

Source: PVGPATDIS, file of 2026-04-10 (ipg191119.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
SiOnyx, LLC 58 patentsUS company or organizationBeverly, MASIONYX Federal lobbying client FUZZY medium confidence: same name (legal endings aside) and statePVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Homayoon HaddadBeaverton, OR27PVGPATDIS, file of 2026-04-10
Jeffrey McKeeTualatin, OR44PVGPATDIS, file of 2026-04-10
Jutao JiangTigard, OR29PVGPATDIS, file of 2026-04-10
Drake MillerTigard, OR15PVGPATDIS, file of 2026-04-10
Chintamani PalsuleLake Oswego, OR16PVGPATDIS, file of 2026-04-10
Leonard ForbesCorvallis, OR235PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiationH10F39/024PVGPATDIS, file of 2026-04-10
H04HBroadcast communicationH04H20/57PVGPATDIS, file of 2026-04-10
H04WWireless communication networksH04W4/90PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2019-10-11Name change
Change of name
SIONYX, INC. signed 2015-08-02SIONYX, LLC BEVERLY, MA50714/351ECORSEXC, file of 2026-09-25
2019-10-11Assignment
Assignment of assignor's interest
FORBES, LEONARD signed 2012-07-25
HADDAD, HOMAYOON signed 2012-08-06
JIANG, JUTAO signed 2012-08-06
MCKEE, JEFFREY signed 2012-08-06
MILLER, DRAKE signed 2012-08-06
PALSULE, CHINTAMANI signed 2012-08-06
SIONYX, INC. BEVERLY, MA50692/517ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.