Patents

US 10449568 B2: Masking substrates for application of protective coatings

Granted
2019-10-22
Filed
2014-01-17 application 14157684
Type
Utility · 11 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A method for applying a protective coating to selected portions of a substrate is disclosed. The method includes applying a mask to or forming a mask on at least one portion of the substrate that is not to be covered with the protective coating. The mask may be selectively formed by applying a flowable material to the substrate. Alternatively, the mask may be formed from a preformed film. With the mask in place, the protective coating may be applied to the substrate and the mask. A portion of the protective coating that overlies the mask may be delineated from other portions of the protective coating; for example, by cutting, weakening or removing material from the protective coating at locations at or adjacent to the perimeter of the mask. The portion of the protective coating that overlies the mask, and the mask, may then be removed from the substrate.

Source: PVGPATDIS, file of 2026-04-10 (ipg191022.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
HZO, Inc. 41 patentsUS company or organizationDraper, UTHZO, INC. Form D issuer EXACT high confidence: identical full name and statePVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
David James AstlePark City, UT4PVGPATDIS, file of 2026-04-10
Tyler Christensen ChildSouth Jordan, UT6PVGPATDIS, file of 2026-04-10
Vimal Kumar KasaganiTaylorsville, UT5PVGPATDIS, file of 2026-04-10
Cameron LaMar LooseRoy, UT5PVGPATDIS, file of 2026-04-10
Blake StevensMorristown, NJ22PVGPATDIS, file of 2026-04-10
Max SorensonCottonwood Heights, UT24PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
B05DProcesses for applying fluent materials to surfaces, in generalB05D1/322PVGPATDIS, file of 2026-04-10
H01LSemiconductor devices not covered by class h10H01L21/6715PVGPATDIS, file of 2026-04-10
C09JAdhesives; non-mechanical aspects of adhesive processes in general; adhesive processes not provided for elsewhere; use of materials as adhesivesC09J9/00PVGPATDIS, file of 2026-04-10
H05KPrinted circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical componentsH05K1/181PVGPATDIS, file of 2026-04-10
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h10H10P72/04PVGPATDIS, file of 2026-04-10
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10H10W74/01PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2023-06-05Security interest Security interest
Security interest
HZO, INC. signed 2023-06-05
HZO HONG KONG LIMITED signed 2023-06-05
CATHAY BANK EL MONTE, CA63861/25PASDL, file of 2026-10-05
2019-02-07Security interest Security interest
Security interest
HZO, INC. signed 2019-02-04CATHAY BANK EL MONTE, CA48284/626ECORSEXC, file of 2026-09-25
2018-01-03Security interest Security interest
Security interest
HZO, INC. signed 2017-12-27CATHAY BANK EL MONTE, CA44995/270ECORSEXC, file of 2026-09-25
2018-01-03Release of security interest
Release of security interest
PACIFIC WESTERN BANK signed 2017-12-29HZO, INC. DRAPER, UT44523/446ECORSEXC, file of 2026-09-25
2016-05-02Security interest Security interest
Security interest
HZO, INC. signed 2013-09-23PACIFIC WESTERN BANK (AS SUCCESSOR IN INTEREST BY MERGER TO SQUARE 1 BANK) DURHAM, NC38435/224ECORSEXC, file of 2026-09-25
2014-04-18Assignment
Assignment of assignor's interest
CHILD, TYLER CHRISTENSEN signed 2014-01-13
KASAGANI, VIMAL KUMAR signed 2014-01-13
LOOSE, CAMERON LAMAR signed 2014-01-13
SORENSON, MAX signed 2014-01-13
STEVENS, BLAKE signed 2014-04-01
ASTLE, DAVID JAMES signed 2014-04-15
HZO, INC. DRAPER, UT32715/148ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.