Patents

US 10403898 B2: Electrolytic copper foil having high tensile strength, electrode including the same, secondary battery including the same, and method of manufacturing the same

Granted
2019-09-03
Filed
2017-07-27 application 15661266
Type
Utility · 4 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A high strength electrolytic copper foil preventing generation of folds, wrinkles, pleats, and breaks during a roll-to-roll (RTR) process, a method of manufacturing the same, and an electrode and a secondary battery which allow high productivity to be secured by being manufactured with such an electrolytic copper foil. The electrolytic copper foil includes a copper film including 99 weight % or more of copper and a protective layer on the copper film, wherein the electrolytic copper foil has a tensile strength of 45 to 65 kgf/mm2.

Source: PVGPATDIS, file of 2026-04-10 (ipg190903.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
KCF TECHNOLOGIES, INC. 36 patentsUS company or organizationAnyang-si, KRPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Seung Min KIMAnyang-si, KR39PVGPATDIS, file of 2026-04-10
Jeong-gil LeeAnyang-si, KR14PVGPATDIS, file of 2026-04-10
Shan JinAnyang-si, KR22PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energyH01M4/661PVGPATDIS, file of 2026-04-10
C25DProcesses for the electrolytic or electrophoretic production of coatings; electroforming; apparatus thereforC25D1/00PVGPATDIS, file of 2026-04-10
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distributionY02E60/10PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2020-11-24Name change
[revised] change of name and corporate address
KCF TECHNOLOGIES CO., LTD. signed 2020-04-24SK NEXILIS CO., LTD. JEONGEUP-SI, JEOLLABUK-DO55693/699PASDL, file of 2026-10-15
2018-07-23Assignment
Assignment of assignor's interest
LS MTRON LTD. signed 2018-07-19KCF TECHNOLOGIES CO., LTD. ANYANG-SI, GYEONGGI-DO46424/303PASDL, file of 2026-10-15
2017-07-27Assignment
Assignment of assignor's interest
JIN, SHAN HUA signed 2017-07-26
KIM, SEUNG MIN signed 2017-07-27
LEE, JEONG GIL signed 2017-07-27
LS MTRON LTD. ANYANG-SI, GYEONGGI-DO43116/642ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.