Patents
US 10356514 B2: Spatial encoding directional microphone array
- Granted
- 2019-07-16
- Filed
- 2017-06-12 application 15571525
- Type
- Utility · 36 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
In certain embodiments, an article of manufacture, such as a cell phone, has a device body with a non-spheroidal shape, such as a parallelepiped, and microphones configured at different locations on the device body. A signal processing system processes the microphone signals to generate a plurality of different output beampatterns in at least two non-parallel directions, wherein, in generating at least one of the output beampatterns, the signal processing system takes into account effects of the device body on the incoming acoustic signal. Four or more microphones can be used to generate B format output beampatterns, such as three dipole beampatterns and an omnidirectional beampattern.
Source: PVGPATDIS, file of 2026-04-10 (ipg190716.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| MH Acoustics, LLC 19 patents | US company or organization | Summit, NJ | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Gary W. Elko | Summit, NJ | 26 | PVGPATDIS, file of 2026-04-10 | |
| Tomas F. Gaensler | Hackettstown, NJ | 11 | PVGPATDIS, file of 2026-04-10 | |
| Jens M. Meyer | Saint Albans, VT | 17 | PVGPATDIS, file of 2026-04-10 | |
| Eric John Diethorn | Long Valley, NJ | 20 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H04R | Loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers; electric hearing aids; public address systems | H04R1/406 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2017-11-03 | Assignment Assignment of assignor's interest | DIETHORN, ERIC J. signed 2017-11-02 ELKO, GARY W. signed 2017-11-02 GAENSLER, TOMAS F. signed 2017-11-02 MEYER, JENS M. signed 2017-11-02 | MH ACOUSTICS LLC SUMMIT, NJ | 44025/868 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.