Patents

US 10293465 B2: Equipment for removing protective coatings from substrates

Granted
2019-05-21
Filed
2015-08-31 application 14841596
Type
Utility · 3 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Apparatuses and systems that enable selective removal of protective coatings from substrates are disclosed. Such a material removal system may use pressurized solid carbon dioxide (CO2) (i.e., dry ice) to remove a selected portion of a protective coating from a substrate. The material removal system may include one or more templates that provide selectivity in removing protective coatings from one or more substrates, fixtures for holding one or more substrates in place while material removal processes occur and apparatuses for positioning one or more substrates at desired locations in material removal systems.

Source: PVGPATDIS, file of 2026-04-10 (ipg190521.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
HZO, Inc. 41 patentsUS company or organizationDraper, UTHZO, INC. Form D issuer EXACT high confidence: identical full name and statePVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Heidi L. PopeckHerriman, UT2PVGPATDIS, file of 2026-04-10
Caleb Edward KanavelSandy, UT2PVGPATDIS, file of 2026-04-10
Samuel R. AndersonSalt Lake City, UT2PVGPATDIS, file of 2026-04-10
Tyler Christensen ChildSouth Jordan, UT6PVGPATDIS, file of 2026-04-10
Daniel J. TriplettProvidence, UT88PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
B24CAbrasive or related blasting with particulate materialB24C1/003PVGPATDIS, file of 2026-04-10
H01LSemiconductor devices not covered by class h10H01L21/67069PVGPATDIS, file of 2026-04-10
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h10H10P72/0421PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2023-06-05Security interest Security interest
Security interest
HZO, INC. signed 2023-06-05
HZO HONG KONG LIMITED signed 2023-06-05
CATHAY BANK EL MONTE, CA63861/25PASDL, file of 2026-10-05
2019-02-07Security interest Security interest
Security interest
HZO, INC. signed 2019-02-04CATHAY BANK EL MONTE, CA48284/626ECORSEXC, file of 2026-09-25
2018-09-14Assignment
Assignment of assignor's interest
CHILD, TYLER CHRISTENSEN signed 2018-01-22
TRIPLETT, DANIEL J. signed 2018-01-23
POPECK, HEIDI L. signed 2018-02-05
ANDERSON, SAMUEL R. signed 2018-08-11
KANAVEL, CALEB EDWARD signed 2018-08-31
HZO, INC. DRAPER, UT46881/170ECORSEXC, file of 2026-09-25
2018-01-03Security interest Security interest
Security interest
HZO, INC. signed 2017-12-27CATHAY BANK EL MONTE, CA44995/270ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.