Patents

US 10190208 B2: Methods for packaging a precursor material

Granted
2019-01-29
Filed
2016-05-09 application 15150023
Type
Utility · 14 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Methods for obtaining a profile for a batch, or lot, of a precursor material and using the profile while processing the precursor material to form a polymer are disclosed. In such a method, a process profile that corresponds to the characteristics of a particular precursor material (e.g., the batch, etc.) may be generated. That process profile may then be used to cause a material processing system to process the precursor material in a manner that accounts for differences between that precursor material and a “standard” precursor material, while providing a polymer and, optionally, a film of “standard” quality. Apparatuses and systems that are configured to obtain profile data for a batch of precursor material, generate or modify a process profile based on the profile data and use the process profile to form a polymer are also disclosed.

Source: PVGPATDIS, file of 2026-04-10 (ipg190129.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
HZO, Inc. 41 patentsUS company or organizationDraper, UTHZO, INC. Form D issuer EXACT high confidence: identical full name and statePVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
James DempsterReno, NV8PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
C23CCoating metallic material; coating material with metallic material; surface treatment of metallic material by diffusion into the surface, by chemical conversion or substitution; coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in generalC23C14/06PVGPATDIS, file of 2026-04-10
B05DProcesses for applying fluent materials to surfaces, in generalB05D1/60PVGPATDIS, file of 2026-04-10
B29BPreparation or pretreatment of the material to be shaped; making granules or preforms; recovery of plastics or other constituents of waste material containing plasticsB29B13/00PVGPATDIS, file of 2026-04-10
B29DProducing particular articles from plastics or from substances in a plastic stateB29D22/003PVGPATDIS, file of 2026-04-10
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for ; moulds, ; reinforcements, fillers or preformed parts, e.g. insertsB29K2023/38PVGPATDIS, file of 2026-04-10
Y10TTechnical subjects covered by former us classificationY10T428/1352PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2023-06-05Security interest Security interest
Security interest
HZO, INC. signed 2023-06-05
HZO HONG KONG LIMITED signed 2023-06-05
CATHAY BANK EL MONTE, CA63861/25PASDL, file of 2026-10-05
2019-02-07Security interest Security interest
Security interest
HZO, INC. signed 2019-02-04CATHAY BANK EL MONTE, CA48284/626ECORSEXC, file of 2026-09-25
2018-01-03Security interest Security interest
Security interest
HZO, INC. signed 2017-12-27CATHAY BANK EL MONTE, CA44995/270ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.