Patents
US 10178754 B2: Circuit board module and electronic device
- Granted
- 2019-01-08
- Filed
- 2018-04-25 application 15962207
- Type
- Utility · 6 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A circuit board module includes: a first electronic component of a surface mounting type; a second electronic component of an insertion mounting type including a lead terminal; a circuit board; and a heat transfer body provided in the circuit board. The first electronic component is mounted on a front surface of the circuit board so as to overlap the heat transfer body in a board thickness direction. The heat transfer body is provided so as to transfer heat generated in the first electronic component to a back surface side of the circuit board. The second electronic component is mounted on a back surface of the circuit board. The second electronic component and the heat transfer body are thermally connected to a heat radiation body provided on the back surface side of the circuit board.
Source: PVGPATDIS, file of 2026-04-10 (ipg190108.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| OMRON AUTOMOTIVE ELECTRONICS CO., LTD. 151 patents | Foreign company or organization | Ebeye, MH | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Ryo Kobayashi | Ebeye, MH | 81 | PVGPATDIS, file of 2026-04-10 | |
| Tomoyoshi Kobayashi | Ebeye, MH | 18 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H05K | Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components | H05K1/0204 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2019-04-24 | Correction Corrective assignment to correct the property number previously recorded at reel: 48826 frame: 958. assignor(s) hereby confirms the assignment. | OMRON AUTOMOTIVE ELECTRONICS CO., LTD. signed 2019-03-04 | OMRON CORPORATION KYOTO | 48982/140 | PASDL, file of 2026-10-15 |
| 2019-03-18 | Assignment Assignment of assignor's interest | OMRON AUTOMOTIVE ELECTRONICS CO., LTD. signed 2019-03-04 | OMRON CORPORATION KYOTO | 48626/958 | PASDL, file of 2026-10-15 |
| 2018-05-16 | Assignment Assignment of assignor's interest | KOBAYASHI, RYO signed 2018-04-04 KOBAYASHI, TOMOYOSHI signed 2018-04-04 | OMRON AUTOMOTIVE ELECTRONICS CO., LTD. AICHI | 45814/920 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.