Patents
US 10175291 B2: Method for protecting an electronic circuit board
- Granted
- 2019-01-08
- Filed
- 2017-11-10 application 15809039
- Type
- Utility · 4 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A method for protecting an assembled circuit board by providing a layer of rosin micro-spheres directly on the components to be protected, heating the micro-spheres to a temperature of about 65° C. for a time sufficient to cause the micro-spheres to flow and the rosin to crosslink, and then allowing the board to cool until the rosin returns to its solid state. The rosin micro-spheres may be put onto the board and components by first loading the microspheres onto a transfer tape and then positioning the transfer tape, microspheres down, over the components to be protected. After the rosin is heated the tape may be removed. The method is effective for protecting assembled boards against airborne S to prevent creep corrosion of the copper metallization, and for protecting against Sn to prevent the formation of tin whiskers in tin-plated or soldered lead-free assemblies.
Source: PVGPATDIS, file of 2026-04-10 (ipg190108.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Foresite, Inc. 4 patents | US company or organization | Kokomo, IN | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Terry L. Munson | Kokomo, IN | 4 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| G01R | Measuring electric variables; measuring magnetic variables | G01R31/2817 | PVGPATDIS, file of 2026-04-10 |
| H05K | Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components | H05K3/28 | PVGPATDIS, file of 2026-04-10 |
| B05D | Processes for applying fluent materials to surfaces, in general | B05D1/286 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2018-04-12 | Assignment Assignment of assignor's interest | MUNSON, TERRY L. signed 2015-01-16 | FORESITE, INC. KOKOMO, IN | 45514/571 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.