Patents
US 10167418 B2: Hot melt silicone and curable hot melt composition
- Granted
- 2019-01-01
- Filed
- 2015-06-16 application 15320513
- Type
- Utility · 9 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A hot melt silicone that is non-flowable at 25° C. and that has a melt viscosity at 100° C. of 5,000 Pa·s or less, the hot melt silicone being formed by subjecting (A) an alkenyl group-containing organopolysiloxane in which 10 mol % or greater of all of silicon atom-bonded organic groups is a phenyl group, and (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule to hydrosilylation reaction in the presence of (C) a hydrosilylation reaction catalyst; and a curable hot melt composition comprising: (I) the hot melt silicone; (II) an organopolysiloxane which has at least two silicon atom-bonded hydrogen atoms in a molecule and in which the amount of silicon atom-bonded hydrogen atom is 0.5 mass % or greater; and (III) a hydrosilylation reaction catalyst. The hot melt silicone is non-flowable at 25° C., has a low surface stickiness, and easily melts by heating. Furthermore, this curable hot melt composition has both hot melt properties and curability.
Source: PVGPATDIS, file of 2026-04-10 (ipg190101.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Dow Corning Corporation 429 patents | US company or organization | Tokyo, JP | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Haruna Yamazaki | Ichihara, JP | 8 | PVGPATDIS, file of 2026-04-10 | |
| Makoto Yoshitake | Ichihara, JP | 36 | PVGPATDIS, file of 2026-04-10 | |
| Ryosuke Yamazaki | Ichihara, JP | 56 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| C09J | Adhesives; non-mechanical aspects of adhesive processes in general; adhesive processes not provided for elsewhere; use of materials as adhesives | C09J183/04 | PVGPATDIS, file of 2026-04-10 |
| C08G | Macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds | C08G77/12 | PVGPATDIS, file of 2026-04-10 |
| C08K | Use of inorganic or non-macromolecular organic substances as compounding ingredients | C08K3/22 | PVGPATDIS, file of 2026-04-10 |
| C08L | Compositions of macromolecular compounds | C08L83/00 | PVGPATDIS, file of 2026-04-10 |
| C09D | Coating compositions, e.g. paints, varnishes or lacquers; filling pastes; chemical paint or ink removers; inks; correcting fluids; woodstains; pastes or solids for colouring or printing; use of materials therefor | C09D183/04 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2019-05-17 | Assignment Assignment of assignor's interest | DOW CORNING TORAY CO., LTD. signed 2019-02-01 | DOW TORAY CO., LTD. SHINAGAWA-KU, TOKYO | 51322/925 | ECORSEXC, file of 2026-09-25 |
| 2017-04-03 | Assignment Assignment of assignor's interest | YAMAZAKI, HARUNA signed 2017-03-18 YAMAZAKI, RYOSUKE signed 2017-03-22 YOSHITAKE, MAKOTO signed 2017-03-23 | DOW CORNING TORAY CO., LTD. CHIYODA-KU, TOKYO | 42138/859 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.