Patents
US 10130009 B2: Natural convection cooling for power electronics systems having discrete power dissipation components
- Granted
- 2018-11-13
- Filed
- 2017-03-15 application 15459187
- Type
- Utility · 16 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A power electronics based system using natural, convection cooling, includes an enclosure housing a plurality of discrete components distributed in a vertical direction from a bottom portion to a top portion of the enclosure and having a heat density weighted average center at a first height along the vertical direction. There is a heat exchanger adjacent to the enclosure, including an inlet port and an outlet port in fluid communication with the enclosure. The heat exchanger has a vertical cooling average center at a second height. There is a cooling fluid disposed in the enclosure and in the heat exchanger to cool the discrete components. The discrete components are positioned in the vertical direction in the enclosure such that the first height of the heat density weighted average center along the vertical direction is below the second height of the vertical cooling average center of the heat exchanger.
Source: PVGPATDIS, file of 2026-04-10 (ipg181113.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| American Superconductor Corporation 53 patents | US company or organization | Ayer, MA | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Jie Yuan | Grafton, MA | 62 | PVGPATDIS, file of 2026-04-10 | |
| Peter Hansen | Holden, MA | 11 | PVGPATDIS, file of 2026-04-10 | |
| John R. Brubaker | Milwaukee, WI | 11 | PVGPATDIS, file of 2026-04-10 | |
| Patrick S. Flannery | Madison, WI | 6 | PVGPATDIS, file of 2026-04-10 | |
| Peter M. Winn | Shrewsbury, MA | 6 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H05K | Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components | H05K7/20245 | PVGPATDIS, file of 2026-04-10 |
| F28D | Heat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact | F28D2021/0031 | PVGPATDIS, file of 2026-04-10 |
| H01F | Magnets; inductances; transformers; selection of materials for their magnetic properties | H01F27/125 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2017-03-15 | Assignment Assignment of assignor's interest | WINN, PETER signed 2017-02-14 YUAN, JIE signed 2017-02-14 BRUBAKER, JOHN signed 2017-02-16 FLANNERY, PATRICK signed 2017-02-16 HANSEN, PETER signed 2017-02-16 | AMERICAN SUPERCONDUCTOR CORPORATION DEVENS, MA | 41580/515 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.