Patents
US 10070569 B2: Method for manufacturing an electronic device
- Granted
- 2018-09-04
- Filed
- 2016-07-08 application 15205696
- Type
- Utility · 10 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A system for assembling electronic devices includes at least one coating element for applying a moisture-resistant coating to surfaces of a device under assembly, or an electronic device under assembly. As components and one or more moisture-resistant coatings are added to the electronic device under assembly to form a finished electronic device, at least one surface on which the coating resides and, thus, at least a portion of the coating itself, is located internally within the finished electronic device. Methods for assembling electronic devices that include internally confined moisture-resistant coatings are also disclosed.
Source: PVGPATDIS, file of 2026-04-10 (ipg180904.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| HZO, Inc. 41 patents | US company or organization | Draper, UT | HZO, INC. Form D issuer EXACT high confidence: identical full name and state | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Blake Stevens | Morristown, NJ | 22 | PVGPATDIS, file of 2026-04-10 | |
| Max Sorenson | Herriman, UT | 24 | PVGPATDIS, file of 2026-04-10 | |
| Marc Chason | Schaumburg, IL | 11 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H05K | Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components | H05K13/0495 | PVGPATDIS, file of 2026-04-10 |
| C08G | Macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds | C08G61/025 | PVGPATDIS, file of 2026-04-10 |
| Y10T | Technical subjects covered by former us classification | Y10T29/49002 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2023-06-05 | Security interest Security interest Security interest | HZO, INC. signed 2023-06-05 HZO HONG KONG LIMITED signed 2023-06-05 | CATHAY BANK EL MONTE, CA | 63861/25 | PASDL, file of 2026-10-05 |
| 2019-02-07 | Security interest Security interest Security interest | HZO, INC. signed 2019-02-04 | CATHAY BANK EL MONTE, CA | 48284/626 | ECORSEXC, file of 2026-09-25 |
| 2018-01-03 | Security interest Security interest Security interest | HZO, INC. signed 2017-12-27 | CATHAY BANK EL MONTE, CA | 44995/270 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.