Patents

US 12176221 B2: Incorporating semiconductors on a polycrystalline diamond substrate

Granted
2024-12-24
Filed
2019-05-31 application 17612201
Type
Utility · 10 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A method for incorporating semiconductors on a diamond substrate. A buffer layer (e.g., GaN) is grown on a transition layer (e.g., AlN/AlGaN) residing on a substrate. A silicon nitride layer is then grown on the buffer layer. After selectively seeding diamond on the silicon nitride layer, the selective seeding of the diamond is dry etched to form regions with seeded diamond and regions without seeded diamond. The silicon nitride is selectively etched in the regions without seeded diamond and diamond is grown in the regions with seeded diamond forming regions of diamond. Additional Group III-nitride semiconductor material (e.g., GaN) is grown in the etched regions without seeded diamond to fill such regions to reach a level of the regions with diamond. An epitaxial overgrowth of the Group III semiconductor material at and above the level of the regions with diamond is then performed.

Source: PVGPATDIS, file of 2026-04-10 (ipg241224.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Texas State University 22 patentsUS company or organizationSan Marcos, TXTexas State University College or university EXACT high confidence: identical full name and statePVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Raju AhmedSan Marcos, TX11PVGPATDIS, file of 2026-04-10
Edwin L. PinerSan Marcos, TX23PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
H01LSemiconductor devices not covered by class h10H01L21/02488PVGPATDIS, file of 2026-04-10
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10H10W99/00PVGPATDIS, file of 2026-04-10
C23CCoating metallic material; coating material with metallic material; surface treatment of metallic material by diffusion into the surface, by chemical conversion or substitution; coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in generalC23C16/27PVGPATDIS, file of 2026-04-10
C30BSingle-crystal growth ; unidirectional solidification of eutectic material or unidirectional demixing of eutectoid material; refining by zone-melting of material ; production of a homogeneous polycrystalline material with defined structure ; single crystals or homogeneous polycrystalline material with defined structure; after-treatment of single crystals or a homogeneous polycrystalline material with defined structure ; apparatus thereforC30B25/183PVGPATDIS, file of 2026-04-10
H10DInorganic electric semiconductor devicesH10D30/475PVGPATDIS, file of 2026-04-10
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h10H10P14/276PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

No recorded assignments or security interests on file for this patent.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.