Patents
US 11926522 B1: Packaging of microfluidic devices and microfluidic integrated systems and method of fabrication
- Granted
- 2024-03-12
- Filed
- 2022-04-12 application 17719045
- Type
- Utility · 13 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A package and method of packaging for integrated microfluidic devices and systems is disclosed wherein a package is made from individually processed and patterned layers of LTCC green tape, that is aligned and stacked, and then co-fired to form a stable LTCC ceramic packaging modules. Subsequently, microfluidic device die and/or integrated microfluidic systems device die are bonded to pre-determined areas of the packaging modules and the modules are aligned bonded together to form leak-free, sealed packages for the microfluidic devices and systems. The use of LTCC materials and techniques provides a low-cost flexible and easily customizable packaging approach for microfluidic devices and systems that can be designed and transitioned into production with significant development time and cost.
Source: PVGPATDIS, file of 2026-04-10 (ipg240312.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Corporation for National Research Initiatives 35 patents | US company or organization | Reston, VA | CORPORATION FOR NATIONAL RESEARCH INITIATIVES Nonprofit EXACT high confidence: identical full name and state | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Michael A. Huff | Oakton, VA | 38 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| B81B | Microstructural devices or systems, e.g. micromechanical devices | B81B7/0061 | PVGPATDIS, file of 2026-04-10 |
| B81C | Processes or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems | B81C1/00301 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2024-02-05 | Assignment Assignment of assignor's interest | HUFF, MICHAEL A., MR. signed 2023-12-07 | CORPORATION FOR NATIONAL RESEARCH INITIATIVES RESTON, VA | 66343/400 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.