Patents

US 11211569 B2: Laser printable organic semiconductor compositions and applications thereof

Granted
2021-12-28
Filed
2017-01-30 application 16073643
Type
Utility · 22 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Organic semiconductor compositions (OSCs) compatible with laser printing techniques are described herein. In being compatible with laser printing techniques, the OSCs are in particulate form and generally comprise an organic semiconductor component and carrier. The organic semiconductor component can comprise any small molecule semiconductor or polymeric semiconductor not inconsistent with the laser printing methods.

Source: PVGPATDIS, file of 2026-04-10 (ipg211228.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
WAKE FOREST UNIVERSITY 60 patentsUS company or organizationWinston-Salem, NCWAKE FOREST UNIVERSITY State business registration EXACT high confidence: identical full name and state
Wake Forest University College or university EXACT high confidence: identical full name and state
WAKE FOREST UNIVERSITY Nonprofit EXACT high confidence: identical full name and state
PVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Oana Diana JurchescuWinston-Salem, NC6PVGPATDIS, file of 2026-04-10
Peter James DiemerMocksville, NC4PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
H10KOrganic electric solid-state devicesH10K71/18PVGPATDIS, file of 2026-04-10
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distributionY02E10/549PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2018-12-13Assignment
Assignment of assignor's interest
DIEMER, PETER JAMES signed 2018-11-28
JURCHESCU, OANA DIANA signed 2018-11-28
WAKE FOREST UNIVERSITY WINSTON-SALEM, NC47762/818ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.