Patents
US 11101439 B2: Thin-film PN junctions and applications thereof
- Granted
- 2021-08-24
- Filed
- 2016-05-27 application 15578041
- Type
- Utility · 25 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
In one aspect, composite materials including a thin-film layer of lateral p-n junctions are described herein, which can be employed in circuits or various components of electrical devices. Briefly, a composite material comprises a thin-film layer including p-type regions alternating with n-type regions along a face of the thin-film layer, the p-type regions comprising electrically conductive particles dispersed in a first organic carrier and the n-type regions comprising electrically conductive particles dispersed in a second organic carrier, wherein p-n junctions are established at interfaces between the p-type and n-type regions. As described further herein, the thin-film layer is flexible, permitting the thin-film to be folded or arranged into a number of configurations to provide various circuits or components of electrical devices.
Source: PVGPATDIS, file of 2026-04-10 (ipg210824.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| WAKE FOREST UNIVERSITY 60 patents | US company or organization | Winston-Salem, NC | WAKE FOREST UNIVERSITY State business registration EXACT high confidence: identical full name and state Wake Forest University College or university EXACT high confidence: identical full name and state WAKE FOREST UNIVERSITY Nonprofit EXACT high confidence: identical full name and state | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| David L. Carroll | Winston-Salem, NC | 49 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H10K | Organic electric solid-state devices | H10K10/29 | PVGPATDIS, file of 2026-04-10 |
| H01L | Semiconductor devices not covered by class h10 | H01L25/115 | PVGPATDIS, file of 2026-04-10 |
| H10D | Inorganic electric semiconductor devices | H10D8/00 | PVGPATDIS, file of 2026-04-10 |
| H10W | Generic packages, interconnections, connectors or other constructional details of devices covered by class h10 | H10W90/00 | PVGPATDIS, file of 2026-04-10 |
| B82Y | Specific uses or applications of nanostructures; measurement or analysis of nanostructures; manufacture or treatment of nanostructures | B82Y30/00 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2020-09-21 | Assignment Assignment of assignor's interest | CARROLL, DAVID signed 2020-09-05 | WAKE FOREST UNIVERSITY WINSTON-SALEM, NC | 53837/279 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.